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Dicyclopentadienyl phenol-based epoxy resins are abbreviated as DCPD epoxy resin. The reaction of dicyclopentadiene with phenol can produce DCPD-phenol resin, and further reaction with epichlorohydrin can obtain DCPD-phenol epoxy resin.
DCPD epoxy resin is a class of epoxy resins with a special skeleton structure. Its molecular structure contains a benzene ring, as well as the alicyclic structure of dicyclopentadiene. Epoxy resins of this type of structure have Low Dk/Df, excellent heat resistance, low hygroscopicity, low elasticity and high adhesion sealing properties.
Grade No. | EEW (g/eq) |
Viscosity (mPa.s) |
N.V. (%) |
|
YLDC-270SS | 260-280 | 200-800 | 75±1 |
Copper-clad laminates
Electronic packaging materials
Molding materials
Flame-retardant coatings
Flame-retardant adhesives
Store in well-ventilated area. Keep away from flames and direct sunlight. Close the cap tightly immediately after use.
All safety information is provided in the Material Safety Data Sheet.
At least 12 months from the date of manufacture in the original packing in ambient temperatures.
Drum package.