Language : English
Phenolic epoxy resin is made by the reaction of linear phenolic resin and epichlorohydrin in the presence of NaOH. Commonly used phenolic epoxy resins are PNE type phenolic epoxy resin, BNE type phenolic epoxy resin, CNE type phenolic epoxy resin. Phenolic epoxy resins are widely used in the fields of machinery and electronics, aerospace, transport, construction and so on because of their excellent process performance, mechanical properties and physical properties.
Phenolic epoxy resin, compared with bisphenol A type epoxy resin, due to the molecular structure contains more than two epoxy groups, the cured product crosslinking density is high, the heat resistance, solvent resistance, chemical resistance and dimensional stability will be relatively improved. However, the brittleness of the cured product increases and the adhesion to copper foil decreases.
CNE type phenolic epoxy resin is basically the same as PNE type phenolic epoxy resin, except that there is a methyl presence on the benzene ring neighbours, which is superior to the latter in terms of water resistance and melt viscosity.
BNE type phenolic epoxy resins compared to conventional phenolic epoxy resins. The cured product has higher heat resistance, its cured product with diaminodiphenylsulfone (DDS) Tg reaches 224 ℃, and the cured product has good overall performance.
Name | Grade No. | EEW (g/eq) |
Softening point (°C) |
Hy-Cl (ppm) |
PNE type phenolic epoxy resin | YLEP-170 | 165-178 | 9000-13000 mPa.s | <300 |
YLEP-172 | 170-175 | 27-31 | <300 | |
YLEP-172S | 170-175 | 31-36 | <300 | |
YLEP-174 | 171-177 | 34-40 | <200 | |
YLEP-173 | 171-175 | 31-35 | <200 | |
YLEP-177 | 174-180 | 44-50 | <300 | |
BNE type phenolic epoxy resin | YLEP-210 | 200-220 | 60-70 | <500 |
YLEP-205 | 190-220 | 65-75 | <500 | |
YLEP-220 | 210-230 | 80-90 | <500 | |
CNE type phenolic epoxy resin | YLEP-201 | 196-206 | 65-70 | <500 |
YLEP-202 | 197-207 | 70-76 | <500 | |
YLEP-207 | 200-215 | 85-95 | <1000 | |
YLEP-207S | 200-215 | 83-88 | <1000 | |
YLEP-205S | 200-210 | 82-87 | <1000 | |
YLEP-211 | 207-215 | 78-83 | <1000 |
Electronic copper-clad laminates
Electronic laminates
Heat resistant adhesive
Heat resistant coatings
Civil engineering materials
Electronic inks
Store in well-ventilated area. Keep away from flames and direct sunlight. Close the cap tightly immediately after use.
All safety information is provided in the Material Safety Data Sheet.
At least 12 months from the date of manufacture in the original packing in ambient temperatures.
Drum package.