Language : English
MDI modified epoxy resin is an isocyanate modified epoxy resin. The soft cyanate ester structure is accessed into the epoxy resin structure, greatly improving the flexibility of the epoxy resin. This type of epoxy resin has very good flexibility and improves the disadvantage that epoxy resin is brittle after curing.
The reaction of epoxy resin with isocyanate can generate oxazolidinone, which is a five-membered heterocyclic structure with thermal stability over 300°C. Epoxy resin containing oxazolidinone can improve the toughness of the epoxy resin system, and increase the bonding strength or peel strength. MDI-modified epoxy resin has been well applied in toughening modification of copper-clad laminate for lead-free or halogen-free products.
Grade No. | EEW (g/eq) |
Viscosity (mPa.s) |
N.V. (%) |
YLEM-280-M75 | 250-310 | 500-2500 | 75±1 |
YLEM-300-M75 | 270-330 | 500-2500 | 75±1 |
Printed circuit substrates
Electronic copper-clad laminates
Electrical laminates
Store in well-ventilated area. Keep away from flames and direct sunlight. Close the cap tightly immediately after use.
All safety information is provided in the Material Safety Data Sheet.
At least 12 months from the date of manufacture in the original packing in ambient temperatures.
Drum package.