Benzoxazine compounds can be synthesized from phenols, formaldehydes and amines with oxygen nitrogen heterocyclic structure with halogen free, which can be homopolymerized to form a polybenzoxazine thermoset networks by heating, also can be co-cured with traditional thermosetting resins like epoxy resin, phenolic resin.   Benzoxazine resins, when heated without curing agent, homopolymerize to form a rigid, nitrogen contained and strong cross-linking network structure that can be used for manufacturing products with excellent mechanical property, high temperature resistance and flame retardancy(UL94-V0). Furthermore, benzoxazine, as a curing agent, can be used in conjunction with all the epoxy resins, phenolic resins etc. to achieve high thermal resistance, strong, low CTE, flame retardancy with halogen free. With these qualities, benzoxazines offer many advantages for formulating halogen-free systems to be used in stringent requirement of CCLs, high speed PCBs, flame retardancy electrical materials and others.   Benzoxazine Key Properties The flame retardancy of benzoxazine series can reach UL-94 V0 level with halogen free, which can be used to improve flammability resistance of products. No byproduct releasing during the curing process, and the dimensional shrinkage rate almost 0. The whole series of products have low water absorption, which can greatly improve the rate of good products. The excellent dielectric property of low dielectric series products shows less effect in frequency fluctuation, witch is intended for use in M2/M4 class PCBs. Benzoxazine products with a wide coverage of Tg and selectivity(150~450℃), and with char yield 78% at 800℃. Benzoxazine resins can be toughened by using unique patented technology, which can significantly improve the machinability of plate products.