Electronic encapsulation adhesive is used to encapsulate electronic devices, is to play a sealing, encapsulation or potting of a class of electronic glue or adhesive. After the electronic encapsulation adhesive package can play the role of waterproof, moistureproof, shockproof, dustproof, anti-corrosion, heat dissipation, confidentiality. Therefore, electronic packaging adhesive needs to have high and low temperature resistance, high dielectric strength, good insulation, environmental protection and safety features.   Why choose epoxy resin? With the continuous development of large-scale integrated circuits and the miniaturisation of electronic components, the heat dissipation of electronic components has become a key issue affecting their service life, and there is an urgent need for high thermal conductivity adhesives with good heat dissipation properties as encapsulation materials. Epoxy resin has excellent heat resistance, electrical insulation, adhesion, dielectric properties, mechanical properties and small shrinkage, chemical resistance, add curing agent and have better processing and operability. Several kinds of special epoxy resin introduction   Biphenyl epoxy resin Tetramethylbiphenyl epoxy resin synthesised by two-step method is cured by DDM and DDS, showing high heat resistance, good mechanical properties and low water absorption.   Silicone-containing epoxy resin Another research hotspot in the field of electronic encapsulation is the introduction of organosilicon chain segments, which can not only improve heat resistance, but also enhance the toughness of the epoxy after curing, and silicone-containing polymers have good flame retardant properties, the low surface energy of silicone-containing groups cause them to migrate to the surface of the resin to form a heat-resistant protective layer, thus avoiding further thermal degradation of the polymer.   Fluorine-containing epoxy resin Fluorine-containing polymers have many unique properties, the fluorine element has the largest electronegativity, the force between the electron and the nucleus is large, the bonding energy of the chemical bond with other atoms is large, the refractive index is low, and the fluorine-containing polymers are excellent in heat resistance, oxidation resistance, and resistance to pharmaceutical properties.  Fluorine-containing epoxy resin with dust self-cleaning, heat, wear, corrosion and other properties and also improve the solubility of epoxy resin, at the same time, has excellent flame retardant, become a new material in the field of electronic packaging.   Dicyclopentadiene-containing epoxy resin Dicyclopentadiene-o-cresol resin can be synthesized by Friedel-Crafts reaction. The resin is cured with methyl hexahydrophthalic anhydride and polyamide 651 curing agent, and the Tg of the cured material is 141°C and 168°C, respectively, which is about 20°C higher than that of the simple E51 cured resin.   Naphthalene-containing epoxy resin A new naphthalene-containing structural phenolic epoxy resin has been synthesised. Its DDS cured product shows excellent heat resistance, Tg is 262°C, 5% heat loss is 376°C.   Alicyclic epoxy resin Alicyclic epoxy resins are characterised by high purity, low viscosity, good workability, high heat resistance, low shrinkage, stable electrical properties and good weathering, etc. They are particularly suitable for high-performance electronic encapsulation materials with low viscosity, high heat resistance, low water absorption and excellent electrical properties, and are highly promising electronic encapsulation materials.   Hybrid modified epoxy resin Blending is an important method to effectively improve material properties. In a kind of epoxy matrix, mixed with another kind of epoxy resin or several kinds of epoxy resin, so that the matrix material of a particular kind of performance or several kinds of specific performance improvement, so as to obtain the comprehensive performance of the new material is more excellent. In epoxy moulding plastics, through the blending can achieve the goal of cost reduction, improve the use of performance and processing performance.   Nanjing Yolatech provides all kinds of high purity and low chlorine epoxy resins, including Bisphenol A epoxy resin, Bisphenol F epoxy resin, Phenolic epoxy resin, Brominated epoxy resin, DOPO modified phenolic epoxy resin, MDI modified epoxy resin, DCPD epoxy resin, Multifunctional epoxy resin, Crystalline epoxy resin, HBPA epoxy resin and so on. And we also could provide all kinds of curing agents or hardeners and diluents.     We will be at your service 24 hours a day. Pls contact us freely.