Dicyandiamide curing agent belongs to the heating curing class of latent curing agent, solid at room temperature, insoluble in epoxy resin, dispersed in epoxy resin in the form of microparticles, through the heating reaction, once heated to the melting point of the vicinity of the start of the dissolution and rapid reaction curing.   Curing reaction of dicyandiamide The molecular structure of dicyandiamide contains a cyano group (-CN) in addition to four active hydrogens. Cyano group can also participate in the curing reaction as a functional group. The curing reaction temperature of dicyandiamide is generally in the range of 160~180°C, and the curing reaction time is 20~60 minutes. For bisphenol A epoxy resin with 190 epoxy equivalents, the theoretical dosage of dicyandiamide curing agent (calculated on the basis of active hydrogen equivalents) is 11.1 parts, but the actual dosage is often in the range of 4-10 parts (based on 100 parts of the resin by mass). Dicyandiamide micropowder is dispersed into the epoxy resin, has a suitable storage period, is stable in storage, does not delaminate, and does not cure.   The fineness of the dicyandiamide particles may vary from product to product. The finer the dicyandiamide particles, the more obvious the performance advantage for curing reaction Ultra-fine dicyandiamide particles are easier to be evenly dispersed into the epoxy resin liquid. Ultra-fine dicyandiamide particles can be better mixed and dissolved in the epoxy resin liquid than ordinary dicyandiamide.   Application areas of dicyandiamide curing compounds Dicyandiamide epoxy resin has good adhesive property, heat resistance and stable storage period. Dicyandiamide epoxy resins can be widely used in powder coatings, carbon fibre prepregs, heat curable inks, laminates, single component adhesives and other applications. Typical applications: Preparation of prepregs for the manufacture of reinforced composites (wind energy, automotive, aerospace, marine engineering and other industries). Electronic packaging materials, adhesives. Powder coatings (especially heavy duty anti-corrosion function). For epoxy-based adhesives (reinforced materials).   Nanjing Yolatech provides all kinds of high purity and low chlorine epoxy resins, including Bisphenol A epoxy resin, Bisphenol F epoxy resin, Phenolic epoxy resin, Brominated epoxy resin, DOPO modified phenolic epoxy resin, MDI modified epoxy resin, DCPD epoxy resin, Multifunctional epoxy resin, Crystalline epoxy resin, HBPA epoxy resin and so on. And we also could provide all kinds of curing agents or hardeners and diluents.   We will be at your service 24 hours a day. Pls contact us freely.    

Epoxy resin adhesive is a reprocessing or modification of epoxy resin to make its performance parameters meet specific requirements. Usually epoxy resin adhesives are also used with curing agents and need to be mixed well to be fully cured. Generally, the epoxy resin adhesive is called A adhesive or main agent, and the curing agent is called B adhesive or curing agent(hardener).   Main properties of epoxy resin adhesives before curing Colur, viscosity, specific gravity, proportioning, gel time, open time, curing time, thixotropy (flow stopping), hardness, surface tension, etc.   Main properties of epoxy resin adhesive after curing Resistivity, proof voltage, water absorption, compressive strength, tensile strength, shear strength, peel strength, impact strength, heat deflection temperature under load, glass transition temperature, internal stress, chemical resistance, elongation, shrinkage coefficient, thermal conductivity, electrical conductivity, weathering resistance, aging resistance, dielectric constant.   Curing characteristics of epoxy resin adhesive Most of the epoxy resin adhesives are heat-setting adhesives. The higher the temperature of the epoxy resin adhesive, the faster the curing. The more the amount mixed at one time, the faster the curing. The curing process has exothermic phenomenon, etc.   Nanjing Yolatech provides all kinds of high purity and low chlorine epoxy resins, including Bisphenol A epoxy resin, Bisphenol F epoxy resin, Phenolic epoxy resin, Brominated epoxy resin, DOPO modified phenolic epoxy resin, MDI modified epoxy resin, DCPD epoxy resin, Multifunctional epoxy resin, Crystalline epoxy resin, HBPA epoxy resin and so on. And we also could provide all kinds of curing agents or hardeners and diluents. We will be at your service 24 hours a day. Pls contact us freely.  

Description Epoxy diluents are mainly used to reduce the viscosity of the epoxy adhesive system, dissolve and disperse and dilute the adhesive, and improve the coating and fluidity of the adhesive. Epoxy diluents also play a role in extending the service life. There are many ways to classify the diluent, according to its use mechanism, it can be divided into two categories of inactive diluent and active diluent.   Inactive diluents Inactive diluents do not contain active groups in their molecules and are mostly inert solvents. They do not react with epoxy resins, hardeners, etc. Inactive diluents are purely physically mixed into the resin. In addition to playing a diluting role, it has an impact on mechanical properties, heat distortion temperature, media resistance and aging damage. In the choice of inactive diluent should consider the solvent evaporation rate, if the evaporation rate is too fast, the surface of the adhesive layer is easy to form a film, preventing the adhesive layer of solvent inside the escape, resulting in bubbles in the adhesive layer. If the evaporation rate is too slow, the solvent remains in the adhesive layer, which will affect the strength of the bond. Usually, several solvents with different boiling points are mixed to regulate the evaporation rate. It is mostly used in rubber adhesive, phenolic adhesive, polyester adhesive and epoxy adhesive.   Reactive diluents Reactive diluents are generally low molecular compounds with one or two or more epoxy groups. They can be directly involved in the epoxy resin curing reaction, become part of the epoxy resin curing material crosslinking network structure. Reactive diluents have almost no effect on the properties of the cured product and can sometimes increase the toughness of the curing system. Active diluent is divided into monofunctional active diluent and difunctional active diluent. Active diluents are generally toxic and must be used with safety in mind. Prolonged contact will often cause skin irritation and in severe cases, even ulcers. Monofunctional active diluent dilution effect is better, aliphatic type has better dilution effect than aromatic type. The acid and alkali resistance of the curing products using aromatic active diluents does not change much, but the solvent resistance is reduced. The use of monofunctional reactive diluents will reduce the heat distortion temperature, which is due to its use will make the cured product crosslinking density decreased. Flexural strength and impact toughness are improved with long carbon chain active diluents. When used in small quantities, it has no effect on the hardness of the cured product, while the coefficient of thermal expansion increases.   Diluent selection principle Try to use active diluents, to improve the processability and at the same time improve its adhesive and mechanical properties. Choose those diluents that are similar to the chemical structure of the main resin. They will participate in the reaction with the main resin in the presence of other additives, and greatly improve the performance of the adhesive layer. Select low volatility, small odor and as low as possible toxicity varieties, to reduce the harm of using active diluent on the human body. Because most of the active or inactive diluents have odor and low toxicity. Should choose the source of easy, non-flammable and non-explosive, low-priced active diluent. Should be through the theory and experiments to choose the most appropriate amount to add.   We Nanjing Yolatech can provide a variety of high purity low chlorine epoxy resin active diluents, widely used in insulation materials, electronic potting, electrical casting and other fields, including 1,4-Butanediol diglycidyl ether(YLD-6018),1,6-Hexanediol diglycidyl ether (YLD-6008), Neopentyl glycol diglycidyl ether(YLD-6009), Neodecanoic acid glycidyl ester(YLD-8001) and so on.   Welcome new and old customers to consult at any time!