Epoxy Resin Application in Electrical and Electronic Appliances

Background

Due to the excellent dielectric properties, mechanical properties, adhesive properties, corrosion resistance, small curing shrinkage and coefficient of linear expansion, good dimensional stability, good workmanship, excellent overall performance, and more due to the flexibility and versatility of the formulation design of epoxy resin materials, epoxy resin materials have been widely used in the field of electrical and electronic appliances.

Applications

Epoxy resin is used in pouring of insulating encapsulation parts for electrical appliances and motors. Such as solenoids, contactor coils, mutual inductors, dry-type transformers and other high and low-voltage electrical appliances, the manufacture of the whole fully sealed insulation encapsulation parts. The appplication of epoxy resin in the electrical appliances industry has been rapid development. From atmospheric pressure casting, vacuum casting has developed to automatic pressure gel forming.

Epoxy resin is widely used for potting insulation of devices equipped with electronic components and circuits. It has become an important and indispensable insulating material for the electronic industry.

Electronic grade epoxy resin molding compound is used for plastic sealing of semiconductor components. In recent years, the development is very fast. Because of its superior performance, there is a trend to use it to replace the traditional metal, ceramic and glass packaging.

Epoxy resin laminated plastics are widely used in the field of electronics and electrical appliances. Among them, the development of epoxy copper-clad laminates is especially rapid, and it has become one of the basic materials in the electronic industry.

In addition, epoxy insulating coatings, insulating adhesives and electronic adhesives are also used in a large number of applications.

Advantages

The role of epoxy resin is to strengthen the integrity of the electronic device, improve the resistance to external impact, vibration. And improve the internal components, line insulation, conducive to device miniaturisation, lightweight. At the same time to avoid direct exposure of components, lines, improve the device's waterproof, moisture-proof performance.

Development

The development direction of epoxy resin electronic and electrical encapsulation and insulation materials is mainly to improve the material's heat resistance, dielectric properties and flame retardancy, reduce water absorption, shrinkage and internal stress.

The main route to improvement is the synthesis of new epoxy resins and curing agents. And improvement the purity of raw materials or modification of epoxy resins, including toughening, flexibilisation, filling, reinforcing and blending. And development of non-bromine flame retardant system. And improvement of moulding process methods, equipment and technology and so on.

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