Language : English
Our crystalline epoxy resin mainly includes Biphenyl phenolic epoxy resin and BHQ biphenyl crystalline epoxy resin and Tetramethyl bisphenol epoxy resin.
Crystalline epoxy resins show high fluidity, low viscosity, low coefficient of linear expansion and low water absorption above the melting temperature. Its cured products have excellent heat resistance, water resistance and electrical properties.
Name | Grade No. | EEW (g/eq) |
Softening point (°C) |
Hy-Cl (ppm) |
|
Biphenyl phenolic epoxy resin | YLEC-290 | 280-300 | 65-75 | <300 | |
Biphenyl liquid crystalline epoxy resin | YLEC-188 | 184-192 | >100 (Melting point) | <300 | |
BHQ biphenyl crystalline epoxy resin | YLEC-174 | 168-180 | >136 (Melting point) | <300 | |
Tetramethyl bisphenol epoxy resin | YLEC-200 | 190-210 | >69 (Melting point) | <300 |
PCB laminates
FPC flexible boards
High performance epoxy adhesives
Electricity-resistant heat-resistant molding compounds
Composites and heat-resistant curable resins
Store in well-ventilated area. Keep away from flames and direct sunlight. Close the cap tightly immediately after use.
All safety information is provided in the Material Safety Data Sheet.
At least 12 months from the date of manufacture in the original packing in ambient temperatures.
Drum package.