I. Introduction One of the most important parameters and starting points for the development of epoxy resin formulations is the epoxy resin curing mechanism and the selection of the specific curing agent to be used. Dicyandiamide is one of the most widely used catalysts for curing one-component epoxy adhesives. This type of adhesive has a long shelf life at room temperature, but offers relatively fast curing at temperatures above 150°C. Dicyandiamide cured epoxy adhesives have a wide range of uses, especially in the transportation, general assembly and electrical/electronic markets.   II. Dicyandiamide Dicyandiamide (also known as “dicy”) is a solid latent curing agent that reacts with both the epoxy group and the secondary hydroxyl group. This curing agent is a white crystalline powder that is easily incorporated into epoxy formulations. Figure 1 is a graphical representation of the dicyandiamide molecule.     This curing agent cures through nitrogen-containing functional groups and consumes the epoxy and hydroxyl groups in the resin. The advantage of dicyandiamide is that it reacts with the epoxy resin only when heated to the activation temperature, and the reaction stops once the heat is removed. It is widely used in epoxy resins and has a long shelf life (up to 12 months). Longer shelf life can be obtained by refrigerated storage. Due to its delayed cure (long shelf life) and excellent properties, dicyandiamide is used in many “Class B” film adhesives. Dicyandiamide is also one of the main catalysts for one-component, high-temperature curing epoxy adhesives. In adhesive formulations, dicyandiamide is used in quantities of 5-7 pph for liquid epoxy resins and 3-4 pph for solid epoxy resins. it is generally dispersed with epoxy resins by ball milling. Dicyandiamide forms very stable mixtures with epoxy resins at room temperature because it is insoluble at low temperatures. The particle size and distribution of the epoxy-dicyandiamide system is critical for extending its shelf life. In general, the best performance is produced when the particle size of the dicyandiamide is less than 10 microns. Fumed silica is commonly used to keep the dicyandiamide particles suspended and evenly distributed in the epoxy resin. When formulated as a one-component adhesive system, epoxy dicyandiamide is stable when stored at room temperature for six months to one year. It is then cured by exposure to 145-160°C for approximately 30-60 minutes. Because of the relatively slow reaction rate at lower temperatures, the addition of 0.2% ~ 1.0% phenyl dimethylamine (BDMA) or other tertiary amine accelerators is sometimes used to reduce the cure time or lower the cure temperature. Other common accelerators are imidazole, substituted urea and modified aromatic amines. Substituted dicyandiamide derivatives can also be used as epoxy curing agents with higher solubility and lower activation temperatures. These techniques can reduce the activation temperature of epoxy-dicyandiamide mixtures to 125°C. Dicyandiamide-cured epoxy resins have good physical properties, heat and chemical resistance. Liquid epoxy cured with 6 pph dicyandiamide has a glass transition temperature of about 120°C, while high temperature curing with aliphatic amines will provide a glass transition temperature of no greater than 85°C.   III. One-component adhesive formulations In one-component epoxy adhesives, the curing agent and resin are compounded together as a single material through an adhesive formulation. The curing agent system is selected so that it reacts with the resin only under appropriate processing conditions. Dicyandiamide-cured epoxy resins are very brittle. Through the use of toughening agents, such as terminated carboxybutyronitrile (CTBN), it is possible to formulate very elastic and tough adhesives without sacrificing the good properties inherent in unmodified systems. With toughened dicyandiamide-cured epoxies, peel strengths are approximately 30 lb/in and tensile shear strengths are in the range of 3000-4500 psi. Toughened dicyandiamide-cured epoxy adhesives also exhibit good resistance to heat cycling. The most effective accelerators for dicyandiamide systems are probably substituted ureas because of their synergistic effect on the performance of the adhesive and their exceptionally good latent delay. It has been shown that the addition of 10 pph of substituted urea to 10 pph of dicyandiamide will produce a bisphenol- a (DGEBA) epoxy liquid diglycidyl ester binder system that cures in only 90 min at 110 °C. However, this adhesive has a shelf life of three to six weeks at room temperature. If longer curing times are acceptable, curing can even be achieved at temperatures as low as 85°C.  

A dielectric is any insulating medium between two conductors. Simply put, it is non-conductive material. Dielectric materials are used to make capacitors, to provide an insulating barrier between two conductors (e.g., in crossover and multilayer circuits), and to encapsulate circuits.   Dielectric Properties Epoxy resin usually has the following four dielectric properties:VR, Dk, Df and dielectric strength. Volume resistivity (VR): It is defined as the resistance measured through the material when a voltage is applied for a specific period of time. According to ASTM D257, for insulation products, it is usually greater than or equal to 0.1 tera ohm-meter at 25°C and greater than or equal to 1.0 mega ohm-meter at 125°C. Dielectric constant (Dk): it is defined as the ability of the material to store charge when used as a capacitor dielectric. According to ASTM D150, it is usually less than or equal to 6.0 at 1KHz and 1MHz, and is a dimensionless value because it is measured as a ratio. The dissipation factor (Df) (also known as the loss factor or dielectric loss): defined as the power dissipated by the medium, usually less than or equal to 0.03 at 1KHz, less than or equal to 0.05 at 1MHz. Dielectric strength (sometimes called breakdown voltage): is the maximum electric field that the material can withstand before breakdown. This is an important characteristic for many applications that require running high currents or amperages. As a general rule of thumb, the dielectric strength of epoxy resins is about 500 volts per mil at 23°C for insulating products. As a practical example, if an electronic circuit needs to resist 1000 volts, a minimum of 2 mils of dielectric epoxy is required. Volume resistivity, dielectric constant, and dissipation factor can be determined experimentally by the adhesive manufacturer; however, dielectric strength depends on the application. Users of epoxy resins should always verify the dielectric strength of the adhesive for their particular application.   Variability of dielectric properties Many dielectric properties will vary with factors unrelated to the properties of the host material, such as: temperature, frequency, sample size, sample thickness and time. Some external factors and how they affect the final results. VR and Temperature As the temperature of the material increases, the VR decreases. In other words, it is no longer an insulator. The main reason for this is that the material is above its glass transition temperature (Tg) and the molecular motion of the monomers entangled in the polymer network is at its highest level. This not only means lower insulation compared to room temperature, but also leads to lower strength and sealing.  Dk and temperature The dielectric constant of room temperature cured epoxy resins increases with temperature. For example, the value is 3.49 at 25°C, becomes 4.55 at 100°C, and 5.8 at 150°C. In general, the higher the value of Dk, the less electrically insulating the material is. Dk and frequency (Rf)  In general, Dk decreases with increasing frequency. As described in the effect of temperature on Dk, room temperature cured epoxy resin has a Dk value of 3.49 at 60Hz, a Dk value of 3.25 at 1KHz and a Dk value of 3.33 at 1MHz. In other words, as Rf increases, the insulating properties of the adhesive increase. Therefore, the lower the Dk value, the more the material acts like an insulator.    Common Applications Dielectric adhesives are used in most semiconductor and electronic packaging applications. Some examples include: semiconductor flip chip underfill, SMD placement on PCBs and substrates, wafer passivation, spherical tops for ICs, copper ring dipping and general PCB potting and encapsulation. All of these areas require maximum insulation to eliminate and prevent any electrical shorts.    Insulation Products Epoxy Technologies offers a wide range of products for dielectric applications that have structural, optical and thermal properties as well as good dielectric properties. All dielectric products are electrical insulators, but many are also heat conductors.

Benzoxazine compounds can be synthesized from phenols, formaldehydes and amines with oxygen nitrogen heterocyclic structure with halogen free, which can be homopolymerized to form a polybenzoxazine thermoset networks by heating, also can be co-cured with traditional thermosetting resins like epoxy resin, phenolic resin.   Benzoxazine resins, when heated without curing agent, homopolymerize to form a rigid, nitrogen contained and strong cross-linking network structure that can be used for manufacturing products with excellent mechanical property, high temperature resistance and flame retardancy(UL94-V0). Furthermore, benzoxazine, as a curing agent, can be used in conjunction with all the epoxy resins, phenolic resins etc. to achieve high thermal resistance, strong, low CTE, flame retardancy with halogen free. With these qualities, benzoxazines offer many advantages for formulating halogen-free systems to be used in stringent requirement of CCLs, high speed PCBs, flame retardancy electrical materials and others.   Benzoxazine Key Properties The flame retardancy of benzoxazine series can reach UL-94 V0 level with halogen free, which can be used to improve flammability resistance of products. No byproduct releasing during the curing process, and the dimensional shrinkage rate almost 0. The whole series of products have low water absorption, which can greatly improve the rate of good products. The excellent dielectric property of low dielectric series products shows less effect in frequency fluctuation, witch is intended for use in M2/M4 class PCBs. Benzoxazine products with a wide coverage of Tg and selectivity(150~450℃), and with char yield 78% at 800℃. Benzoxazine resins can be toughened by using unique patented technology, which can significantly improve the machinability of plate products.

The viscosity of water-based resins is a crucial parameter in various industrial applications, influencing the ease of application, flow characteristics, and overall performance of the end product. Several key factors determine the viscosity of these resins, including molecular weight, solubility, and the presence of solid particles. Understanding these factors is essential for optimizing resin formulations and achieving the desired properties.   Molecular Weight One of the primary factors affecting the viscosity of water-based resins is their molecular weight. Higher molecular weight resins exhibit higher viscosity. This phenomenon occurs because longer polymer chains in high molecular weight resins lead to greater intermolecular interactions. These interactions create more resistance to flow, thus increasing the viscosity. In essence, as the molecular weight increases, the mobility of the resin molecules in water decreases, resulting in a thicker, more viscous solution. 1. Polymer Chain Length and Interactions Longer polymer chains in high molecular weight resins have more extensive entanglements and interactions between chains. These interactions can include van der Waals forces, hydrogen bonding, and even ionic interactions, depending on the resin's chemical structure. These forces collectively hinder the movement of resin molecules, increasing the energy required for flow and thereby raising the viscosity. 2. Practical Applications In practical applications, resins with higher molecular weights are often used when a thicker consistency is desired. For example, in coatings that require a high-build film or adhesives that need strong bonding capabilities, higher molecular weight resins provide the necessary viscosity and performance characteristics.   Solubility The solubility of the resin in water also significantly impacts its viscosity. Resins with lower solubility tend to have higher viscosity. This is because poorly soluble resin molecules do not disperse well in water, leading to aggregation or clustering of the resin molecules. These aggregates create a higher resistance to flow, thereby increasing the viscosity. Essentially, when the solubility of the resin decreases, the uniform distribution of resin molecules in the water is compromised, leading to a more viscous mixture. 1. Aggregation and Clustering Low-solubility resins tend to form aggregates or clusters in water. These clusters increase the effective particle size within the solution, which in turn increases the resistance to flow. The presence of these larger, less dispersed particles means that more energy is required to move the solution, resulting in higher viscosity. 2. Applications Requiring Specific Solubility In applications where specific solubility properties are needed, the choice of resin solubility is critical. For instance, in waterborne paints and coatings, a balance between solubility and viscosity must be achieved to ensure easy application while maintaining good film-forming properties.   Solid Particles The shape and size of solid particles within the resin also play a vital role in determining viscosity. Irregularly shaped particles and larger particles contribute to higher viscosity. Irregular shapes and larger sizes increase the friction and interaction between particles and the surrounding medium, thereby increasing resistance to flow. As a result, resins containing such particles exhibit higher viscosity compared to those with smaller, more regularly shaped particles. 1. Particle Shape and Surface Area Irregularly shaped particles have larger surface areas and more points of contact with other particles and the surrounding fluid. This increased surface area leads to higher friction and interaction forces, making it more difficult for the particles to move past each other, thus increasing viscosity. 2. Size Distribution The size distribution of solid particles also affects viscosity. A wide size distribution can lead to a more compact packing of particles, increasing the density and interaction within the resin, thereby increasing viscosity. Conversely, a narrow size distribution can result in a more uniform and potentially lower viscosity.   Practical Implications Understanding these factors is crucial for formulating water-based resins with the desired viscosity. For instance, in applications requiring easy application and smooth flow, resins with lower molecular weight and higher solubility might be preferred. Conversely, for applications needing thicker consistency and higher viscosity, such as in certain coatings or adhesives, higher molecular weight resins or those with lower solubility might be more suitable.   Tailoring Resin Properties Manufacturers can tailor resin properties by adjusting molecular weight, solubility, and particle characteristics to meet specific application requirements. By optimizing these factors, it is possible to achieve the desired balance between viscosity, performance, and application ease.   Conclusion In summary, the viscosity of water-based resins is influenced by molecular weight, solubility, and the characteristics of solid particles within the resin. By carefully considering and adjusting these factors, manufacturers can tailor the properties of water-based resins to meet specific application requirements, ensuring optimal performance and functionality. This nuanced understanding allows for the development of high-quality resins that perform effectively in a variety of industrial applications.  

  n-Heptanol (1-Heptanol) and n-Hexanol (1-Hexanol) are both primary alcohols, which means they each have a hydroxyl group (-OH) attached to a primary carbon atom. These alcohols are important in various industrial applications due to their unique properties.   n-Heptanol (1-Heptanol) Chemical Structure and Properties Chemical Formula: C7H16O Molecular Weight: 116.2 g/mol Boiling Point: 175.8 °C (348.4 °F) Density: 0.818 g/cm³ 1-Heptanol, also known as heptan-1-ol or heptyl alcohol, is a clear, colorless liquid with a mild, characteristic odor. It is slightly soluble in water but more soluble in organic solvents such as ethanol and ether.   Uses and Applications Flavoring Agent: Due to its pleasant odor, 1-Heptanol is used in the flavor and fragrance industry to impart fruity and floral notes. Chemical Intermediate: It serves as a precursor in the synthesis of various esters, which are used in perfumes and flavorings. Solvent: 1-Heptanol can be used as a solvent in the formulation of resins, coatings, and pharmaceuticals. Lubricant Additive: It is sometimes used as an additive in lubricants to enhance performance and stability.   Production 1-Heptanol is produced through the catalytic hydrogenation of heptanal or by the hydroformylation of hexene followed by hydrogenation.   n-Hexanol (1-Hexanol) Chemical Structure and Properties Chemical Formula: C6H14O Molecular Weight: 102.2 g/mol Boiling Point: 157 °C (315 °F) Density: 0.814 g/cm³ 1-Hexanol, also known as hexan-1-ol or hexyl alcohol, is a colorless liquid with a slightly floral odor. It is moderately soluble in water and highly soluble in most organic solvents.   Uses and Applications Fragrance and Flavor: Similar to 1-Heptanol, 1-Hexanol is used in the fragrance industry to produce floral and green odors. Solvent: It acts as a solvent for lacquers, resins, and oils. Plasticizer: 1-Hexanol is used in the production of plasticizers, which are added to plastics to increase their flexibility. Intermediate in Chemical Synthesis: It is a building block in the synthesis of various chemicals, including plasticizers, pharmaceuticals, and surfactants.   Production 1-Hexanol is typically produced by the hydroformylation of pentene, followed by hydrogenation of the resulting aldehyde. Alternatively, it can be obtained from the reduction of hexanoic acid.   Conclusion n-Heptanol and n-Hexanol are versatile chemicals with a wide range of applications in various industries. Their roles as solvents, intermediates in chemical synthesis, and components in fragrances and flavors highlight their importance. Understanding their properties and production methods can help optimize their use in industrial processes and product formulations.  

With the rapid development of marine ports, terminals, offshore wind power and shipbuilding industry, the demand for concrete and steel structures in marine engineering is getting bigger and bigger. The durability and reliability of reinforced concrete structure is an important quality indicator for construction projects, and corrosion is an important factor affecting it, in the actual project, the various effects brought about by corrosion is one of the most important concerns of construction engineers. Long-term immersion in seawater or in humid corrosive environments can be damaged by environmental agents such as chloride ions, sulphate ions and CO2, so practical anti-corrosion measures can be used to ensure and extend the service life of these infrastructures.   We take advantage of the permeability of concrete and use epoxy resin protective coatings to penetrate into the concrete surface to a certain depth to block the pores completely or form a continuous film on the surface to close the pores, so that the concrete surface can be effectively protected.   Epoxy resin coating can be cured at room temperature, the cured coating film has good adhesion, bonding, while having good mechanical properties and corrosion resistance. As an excellent reinforcing and protective coating, epoxy resin coating has been widely used in the protection of reinforced concrete structures at home and abroad.   Epoxy resin protective coating performance characteristics Good adhesion with concrete Good resistance to acid and alkali corrosion Resistance to salt water immersion Good abrasion resistance Curing at room temperature, good constructability Good sealing and impermeability to concrete.

Amino resin can enhance the flexibility of the paint film, make it more wear-resistant, impact resistance, and improve the weather resistance of the paint film.   The role of amino resin mechanism Amino resin is a multifunctional polymer, with stable properties, high transparency, good hardness, water resistance and other advantages, it plays the role of crosslinking agent in the paint curing process. Amino resin and the base resin co-condensation at the same time, will also occur self-condensation reaction, so as to form a three-dimensional network structure, to enhance the mechanical strength of the paint film and chemical resistance.   Amino resin as a cross-linking agent Amino resin as a crosslinking agent, in 100 ℃ below the degree of reaction is low, but when the temperature rises to 150 ℃ or more, the degree of crosslinking reaction is significantly increased. It is noteworthy that even at 200°C, the degree of reaction is only close to 90%, indicating that the amino resin still has good reactivity at high temperatures. Amino resin as a crosslinking agent added to the paint, can effectively enhance the flexibility of the paint film. Its enhancement mechanism mainly has the following three aspects: 1. increase the elasticity of the paint film 2. reduce the surface tension of the film 3. enhance the adhesion of the coating   The type and characteristics of amino resin Amino resin types are diverse, according to its structure in the different functional groups, can be divided into polymerisation type part of alkylation, polymerisation type high subamino and monomer type high alkylation, etc., can also be divided into urea formaldehyde amino, isobutylation, n-butylation, benzene substitution of amino, part of the methyl etherification and complete methyl etherification and so on. These different types of amino resins in the reactivity, crosslinking temperature and the final film properties have their own characteristics.   Ratio of amino resin to acrylic resin Because the molecular weight of acrylic resin is large, and the molecular weight of monomer type HMMM is small, so in order to fully react, the amount of HMMM, it should be a lot of excess; Generally is controlled in the main body resin: amino resin = (1.7: 1 ~ 4: 1), based on the higher temperature, more likely to tend to self-crosslinking, so when the temperature is higher, the amount of amino resin should be increased, generally keep in the upper limit of the ratio, so as to ensure the effectiveness of the crosslinking reaction. In addition, if the amount of hydroxyl group contained in the main resin is high, the proportion of amino resin should be increased accordingly.   Nanjing Yolatech provides all kinds of high purity and low chlorine epoxy resins, including Bisphenol A epoxy resin, Bisphenol F epoxy resin, Phenolic epoxy resin, Brominated epoxy resin, DOPO modified phenolic epoxy resin, MDI modified epoxy resin, DCPD epoxy resin, Multifunctional epoxy resin, Crystalline epoxy resin, HBPA epoxy resin and so on. And we also could provide all kinds of curing agents or hardeners and diluents.     We will be at your service 24 hours a day. Pls contact us freely.  

Product information 1.3-BAC is a diamine substance, it is colourless transparent and low viscosity liquid at room temperature, it has obvious ammonia smell, corrosive and combustible when it meets open fire. It belongs to cyclic aliphatic amine, when used as epoxy curing agent, it has both the high activity of aliphatic amine and the excellent mechanical properties, temperature resistance and yellowing resistance of alicyclic amine, it is often used in the preparation of high-quality epoxy adhesive products.   Application Mainly used as epoxy curing agent or preparation of modified epoxy curing agent, not only low viscosity, good operability, and excellent room temperature curing performance, its products in the mechanical properties, temperature resistance, water resistance, chemical resistance and other aspects of the excellent preparation of high-quality epoxy adhesives, flooring paints, etc., are widely used in high-end flooring, jewelry adhesive, crystal adhesive, stone adhesive industry; at the same time, due to its excellent mechanical properties, good operability, also used in composite materials. At the same time, due to its excellent mechanical properties and good operability, it is also used in composite material industry (automobile, wind blade, etc.).   Ratio Epoxy resin 128 (epoxy equivalent 190):100 Amount of curing agent: 17~20   Nanjing Yolatech provides all kinds of high purity and low chlorine epoxy resins, including Bisphenol A epoxy resin, Bisphenol F epoxy resin, Phenolic epoxy resin, Brominated epoxy resin, DOPO modified phenolic epoxy resin, MDI modified epoxy resin, DCPD epoxy resin, Multifunctional epoxy resin, Crystalline epoxy resin, HBPA epoxy resin and so on. And we also could provide all kinds of curing agents or hardeners and diluents.   We will be at your service 24 hours a day. Pls contact us freely.  

Calculation of Anhydride-type Curing Agent Dosage   When using anhydride curing agents, we can generally calculate the dosage using the following formula:   Where "c" is the correction factor: For general anhydrides, c=0.85−0.9c = 0.85 - 0.9； For using tertiary amine curing agents, c=1； For using chlorinated anhydrides, c=0.6c = 0.6.   Example: If the relative molecular mass of Methyl Tetrahydrophthalic Anhydride (MTHPA) is 168, and it contains one anhydride group, To calculate the amount of anhydride needed for curing E-51 epoxy resin, the dosage calculation is: This means that approximately 77 grams of MTHPA are needed to cure 100 grams of E-51 epoxy resin.   Precautions Anhydride-type curing agents are quite corrosive. Proper and careful handling is required. Wear gloves, masks, and other protective gear to avoid inhalation and contact. Clean thoroughly after handling.

Some reasons for epoxy resin yellowing Photo-oxidation reaction Epoxy resin is susceptible to ultraviolet rays and oxygen in the sunlight caused by the oxidation of the aniline group in the epoxy resin, which in turn leads to the phenomenon of yellowing of epoxy resin glue; Thermal degradation Long-term high temperature conditions, epoxy resin will find thermal degradation, which will lead to molecular chain breakage, yellowing phenomenon; Some chemical reactions Epoxy resin adhesive and some substances in contact with chemical reactions, yellowing; for example, substances containing sulfide and epoxy resin contact; Curing agent and accelerator reasons The free amine component in the amine curing agent directly polymerises with the epoxy resin, resulting in local heating of the glue and accelerated yellowing; In the heat aging process, the amine curing epoxy resin material surface has a large number of imine presence, thus easier degradation and yellowing. Tertiary amine accelerators, nonylphenol accelerators in the thermal oxygen, UV irradiation is also easy to yellowing;   How to avoid epoxy resin yellowing Reduce the irradiation of ultraviolet rays In the production and application process of epoxy resin, must avoid the influence of high temperature and ultraviolet rays, prevent epoxy resin oxidation reaction. Add yellowing-resistant additives Adding antioxidant and UV absorber can greatly delay the aging and oxidation of epoxy resin, thus prolonging its service life and preventing yellowing. Curing agent selection Amine curing agent, try to choose the amine curing agent with less free amine content; Anhydride curing agent, epoxy system in the anhydride curing agent is heat aging and light aging type of excellent.   The conclusion The yellowing of epoxy resin is caused by a variety of factors. The most important is ultraviolet radiation, if it is an outdoor product, it is recommended to add a certain amount of ultraviolet absorber to delay the yellowing, and it is best to add some antioxidants together as well, to play a concordant effect. Adding UV diluents and antioxidants can not fundamentally solve the epoxy resin yellowing, but only delay yellowing, so that the product transparency lasts for a period of time.  

We all know that a separate epoxy resin is not conductive, how to make it with conductive properties, we all know that to conduct electricity, then you need a conductive medium, that epoxy conductive adhesive is the same reason, in the glue filled with randomly distributed metal or conductive carbon particles and other conductive media, so that epoxy resin with conductive properties.   Types of conductive adhesive Generally speaking, conductive adhesive is composed of two parts: the matrix and conductive filler: 1. commonly used matrix including epoxy resin, silicone resin, polyimide resin, phenolic resin, polyurethane, acrylic resin and so on. Compared with other resins, epoxy resin has the advantages of good stability, corrosion resistance, low shrinkage, high bonding strength, bonding surface and good processability, therefore, epoxy resin is currently the most researched and widely used matrix materials. 2. conductive filler usually carbon, metal, metal oxide three categories. Conductive adhesive requires conductive particles itself to have good conductive properties, particle size should be in the appropriate range, can be added to the conductive adhesive matrix to form a conductive pathway. Conductive filler can be gold, silver, copper, aluminium, zinc, iron, nickel powder and graphite and some conductive compounds. Currently in actual production, the most widely used is silver powder.   The role of conductive adhesive Epoxy resin conductive adhesive belongs to is non-polluting welding materials. Under normal circumstances epoxy resin is not conductive, but if the conductive silver paste and epoxy resin combination, their mixture can conduct electricity. Generally silver paste is the most common conductive filler, but materials such as gold, nickel, copper and carbon can also be used. Another advantage of epoxy resins is that they are thermally conductive, which means they can cool electronic components. At present, many electronic components tend to be miniaturised, lightweight, highly integrated development, it is difficult to use a large number of welded materials to be made, if the use of conductive adhesive can be avoided the adverse effects of welding.   Epoxy resin conductive adhesive features Has excellent adhesive strength. With all types of substrates can achieve good adhesion; Formulation design is rich. With different curing agents, can prepare single-component adhesive or multi-component adhesive. Room temperature curing, medium temperature curing and high temperature curing. Good heat resistance; Low curing shrinkage and stable properties; Good chemical resistance.   The main application of epoxy resin conductive adhesive Instead of solder for electronic components and printed circuit boards, glass, ceramic bonding, such as a variety of consumer electronics, communications equipment, automotive parts, industrial equipment, medical equipment, to solve the electromagnetic compatibility (EMC) and so on. Electronic packaging: such as LCD, LED, integrated chips, printed circuit board components, ceramic capacitors and other electronic components and components of the package. Photovoltaic panel bonding: to improve the defective rate of the cell due to solder, reduce costs and increase the photoelectric conversion rate. Used as structural adhesive for bonding: metal-to-metal bonding, component lead bonding, battery terminal bonding.   Nanjing Yolatech provides all kinds of high purity and low chlorine epoxy resins, including Bisphenol A epoxy resin, Bisphenol F epoxy resin, Phenolic epoxy resin, Brominated epoxy resin, DOPO modified phenolic epoxy resin, MDI modified epoxy resin, DCPD epoxy resin, Multifunctional epoxy resin, Crystalline epoxy resin, HBPA epoxy resin and so on. And we also could provide all kinds of curing agents or hardeners and diluents.           We will be at your service 24 hours a day. Pls contact us freely.

When mixing curing agents, the dosage calculation can be referred to as follows:   1. Firstly, calculate the active hydrogen equivalent X of the curing agent mix: Assuming that two curing agents, A and B, are used, and that the proportion of curing agent A in the mix is a per cent, and the proportion of curing agent B in the mix is b%  The proportion of curing agent A in the curing agent mix is a%, the proportion of curing agent B in the curing agent mix is b% a% of curing agent A / active hydrogen equivalent of curing agent A + b% of curing agent B / active hydrogen equivalent of curing agent B = 100/X; e.g.: If: 60% D-230 (AHEW=~60) mixed with 40% IPDA (AHEW=~42) is to be used in the curing agent mix. The active hydrogen equivalent of the mixed curing agent is calculated as: 60/60 + 40/42 = 100/X, X = 51.28 This results in an active hydrogen equivalent of 51.28 for our curing agent mix.   2. Calculate the amount of mixed curing agent to be used for 100 grams of E-51 Bisphenol A epoxy resin according to the formula for the amount of amine curing agent: w (mixed curing agent) % = 51.28/186 ✕ 100=~27.6 That is, for every 100 grams of E-51 BPA epoxy resin epoxy resin to use about 27.6 grams of mixed curing agent.