Language : English
Bisphenol F epoxy resin, also known as bisphenol F diglycidyl ether, referred to as BPF, is prepared by the reaction of phenol and formaldehyde under acid catalysis to produce bisphenol F, and then with epichlorohydrin in the presence of sodium hydroxide polycondensation reaction. This is a new type of epoxy resin developed in order to reduce the viscosity of bisphenol A epoxy resin itself and have the same properties. It is usually a liquid bisphenol F epoxy resin obtained by the reaction of bisphenol F (diphenol methane) and epichlorohydrin under the action of NaOH.
Bisphenol F epoxy resin is characterized by low viscosity, less than 1/3 of the viscosity of bisphenol A epoxy resin,and has good impregnation of fiber. Its curing properties are almost the same as those of bisphenol A epoxy resins, but with slightly lower heat resistance and slightly better corrosion resistance. Liquid bisphenol F epoxy resin can be used for solvent-free coatings, adhesives, cast plastics, FRP and carbon fiber composites.
Grade No. | EEW (g/eq) |
Viscosity (mPa.s) |
Hy-Cl (ppm) |
YLE-170K | 155-165 | ≤1600 | <100 |
YLE-170S | 165-167 | 2700-3700 | <150 |
YLE-170 | 165-175 | 3500-4500 | <150 |
YLE-170H | 165-175 | 5000-6000 | <150 |
YLE-170N | 165-169 | 5000-6000 | <300 |
Adhesive
Insulation
Composites (Glass fiber, carbon fiber winding material)
Coating
Electrical and electronic industry (Potting, casting, impregnation)
Civil wood bedding
Store in well-ventilated area. Keep away from flames and direct sunlight. Close the cap tightly immediately after use.
All safety information is provided in the Material Safety Data Sheet.
At least 12 months from the date of manufacture in the original packing in ambient temperatures.
Drum package.